BCM63153B1UKFSBG
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제조 업체:
브로드컴은 제한했습니다
기술:
212, BONDED, V/ADSL, 10G GW,NO VOIP/SPU
범주:
전자 반도체
상술
Package ::
BGA
Packaging ::
Tray
Product Category ::
RF System on a Chip - SoC
RoHS ::
Green available
Manufacturer ::
Broadcom Limited
소개
The BCM63153B1UKFSBG,from Broadcom Limited,is RF System on a Chip - SoC.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!
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